A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization

Abstract The reliability of electronic assemblies is a vital criterion used to assure product quality over its lifetime. Weibull distribution the most common utilized describe data. Most studies use scale parameter, or characteristic life, compare alternatives and make selective decision. This may not lead achieving optimal parameters which can be problematic because this method doesn’t consider variability behavior fatigue life. In study, new approach for process selection proposed find parameter values that improve micro-optimality based on examining solder joint by using multi criteria analysis. fuzzy logic as tool solve problem presented from approach. microelectronic connections in thermal cycling operating conditions validation case study. are found ball grid array components. Two levels sphere materials, three surface finish, 10 paste alloys studied parameters. Using approach, four responses employed assess data, including B10 (life at 10% population failure), mean-standard deviation response, signal noise ratio (SNR). applied multiresponse problem. An setting considers different characteristics was ENIG SAC305 sphere, material six were factor obtained aged CABGA208 component